Longer lasting, faster charging, and lower cost with X2F
X2F encapsulates electronics and circuitry using a low pressure, controlled viscosity process that does not damage delicate components.
X2F can mold thermally conductive and highly filled materials with step change improvement material properties that are impossible to mold with other equipment.
Extreme Durability across range of conditions
10X higher thermal conductivity
Up to 200% improved product performance
Processing polymers for high temperature applications & EMI shielding
Enabling superior customer products
High volume capability (1-4 Mil units/system)
High yields >99% & shorter cycles
Integration into robotic work cell
$10B+ market opportunity
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