Batteries and Electronics

10X increase in thermal conductivity for critical electronics

Longer lasting, faster charging, and lower cost with X2F

Application Overview

X2F encapsulates electronics and circuitry using a low pressure, controlled viscosity process that does not damage delicate components.

X2F can mold thermally conductive and highly filled materials with step change improvement material properties that are impossible to mold with other equipment.

Performance Advantages

Extreme Durability across range of conditions

10X higher thermal conductivity

Up to 200% improved product performance

Processing polymers for high temperature applications & EMI shielding

Enabling superior customer products

Operational Advantages

High volume capability (1-4 Mil units/system)

High yields >99% & shorter cycles

Integration into robotic work cell

$10B+ market opportunity

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