Longer lasting, faster charging, and lower cost with X2F
Batteries with up to 200% better performance with X2F
Reduced operating temperature of motors
Increased Thermal Protection For Electronics
Smart Glasses & Wearables with Added Functionality
Application Overview
X2F encapsulates electronics and circuitry using a low pressure, controlled viscosity process that does not damage delicate components.
X2F can mold thermally conductive and highly filled materials with step change improvement material properties that are impossible to mold with other equipment.
Performance Advantages
Extreme Durability across range of conditions
10X higher thermal conductivity
Up to 200% improved product performance
Processing polymers for high temperature applications & EMI shielding
Enabling superior customer products
Operational Advantages
High volume capability (1-4 Mil units/system)
High yields >99% & shorter cycles
Integration into robotic work cell
$10B+ market opportunity
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