HIGHER PERFORMANCE AND LOWER COST PROCESS
X2F encapsulates electronics and circuitry using a low pressure, controlled viscosity process that does not damage delicate components.
X2F can mold thermally conductive and highly filled materials that are impossible to mold with other equipment.
Extreme Durability across range of conditions
Thermally conductive polymers
High volume capability (1-4 Mil units/system)
High yields >99% & shorter cycles
Large substrate sizes
Integration into robotic work cell
$10B+ market opportunity
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