Protected Electronics

Protecting Delicate Electronics & Circuitry

HIGHER PERFORMANCE AND LOWER COST PROCESS

Application Overview

X2F encapsulates electronics and circuitry using a low pressure, controlled viscosity process that does not damage delicate components.

X2F can mold thermally conductive and highly filled materials that are impossible to mold with other equipment.

Performance Advantages

Extreme Durability across range of conditions

Thermally conductive polymers

Operational Advantages

High volume capability (1-4 Mil units/system)

High yields >99% & shorter cycles

Large substrate sizes

Integration into robotic work cell

$10B+ market opportunity

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