X2F’s New Capability Opens up Higher Volume Production

X2F’s New Capability Opens Up Higher-Volume Production for Encapsulated Electronics and Automotive Optics

Company Adds Rotary Table to its Transformative Plastics Molding Process

by Joseph Grande for Business Wire | March 2, 2022

LOVELAND, Colo.–(BUSINESS WIRE)–X2F, the developer of a transformative plastics processing technology, has added a rotary table which reduces cycle times and opens up higher-volume production for its controlled viscosity molding machine. The rotary table enables X2F to reach production volumes of up to four million parts per year, depending on the cycle time, for the manufacture of critical components in the electronics, automotive, industrial, and medical industries.

“Our technology enables the manufacture of previously impossible-to-mold thermoplastic parts that provide step-change improvements in thermal conductivity, EMI shielding, and high-temperature capability in electronics,” said Michael Slowik, CEO of X2F. “Key applications in electric vehicle batteries, metaverse hardware, and mobile phones are driving customer engagement.”

X2F’s new rotary table will allow the company to efficiently and economically serve its customers’ high-volume needs while delivering material properties not currently available at scale.

X2F’s new molding technology enables the manufacture of complex product designs using previously “un-moldable” materials from prototyping to production-scale. The controlled viscosity process dramatically reduces material degradation and molded-in stress inherent in today’s conventional molding technologies. The process also allows for the use of greater amounts of filler and additives than is currently possible. The result is more complex, stronger, and durable parts with advanced material properties.

X2F is deploying the technology in applications that include optics, overmolded electronics, and highly-filled engineering resins. In automotive lighting applications, X2F can produce complex geometries, thicker lenses, and larger shapes. In encapsulated electronics, the technology allows for new materials with advanced properties, fewer production steps, dramatically improved yields, and shorter cycle times. For highly-filled resins like polyetheretherketone (PEEK), the process permits increased glass or carbon fiber loadings, which dramatically improves strength and stiffness by 20%.