Advanced PCB Protection
- Instead of stacked brackets and fasteners, we integrate packaging features into molded carriers to simplify assembly.
- Traditional protection can be cure-time heavy and hard to rework. We enable protective coverage that supports repeatable builds with reduced stress on electronics.
- Traditional protection approaches can introduce cure time, rework friction, and variability. We enable protective coverage around electronics with reduced mechanical stress and repeatable processing.
- Electronics packaging can become hardware-heavy. We consolidate mechanical support into molded structures to reduce part count and simplify packaging.
- Thermal packaging is often interface-heavy. We enable more integrated protective coverage that supports thermal-driven electronics packaging.
Connectors
- Instead of building retention with secondary parts, we integrate retention into the molded connector body to simplify builds.
RF & Antenna Components
- RF components can be constrained by variability in filled systems under high shear. We enable more consistent molded RF structures using specialized polymer systems.
Enclosures & Housings
- Ruggedized housings often start as assemblies or machined parts. We help transition to scalable molded housings when designs are ready for production.
- Sensor packaging is frequently limited by tolerance stack-up. We enable molded housings with integrated datum features that reduce downstream adjustment work.
- High-shear processing can restrict reinforced polymer options. We enable more workable reinforced choices for molded mounts and brackets.
Power Distribution
- Harsh-environment power systems often require layered protection schemes. We enable encapsulated bus solutions that reduce exposed interfaces and simplify protection.
Optical Components
- Optical carriers often require fixtures and secondary alignment steps. We support more integrated molded carriers with consistent geometry.
Thermal Management
- Thermal solutions often involve pads, adhesives, and multiple interfaces. We enable more integrated molded thermal interface structures using filled polymers.
Manufacturing for Defense Electronics and Structures
Defense electronics and electromechanical systems frequently accumulate bracket stacks, secondary hardware, multi-step sealing, and conservative packaging to mitigate risk introduced by high-pressure molding, high-shear processing, and traditional potting or coatings. These legacy approaches introduce warp, fiber damage, insert shift, internal stress, cure-time friction, and thermal-interface complexity—driving larger assemblies, higher part counts, and reduced repeatability in navigation electronics, radar and lidar systems, PCBs, connectors, bus bars, and sensor platforms.
Controlled molding, insert molding, and low-pressure encapsulation address these root process limitations directly. Engineered and reinforced polymer systems (including short carbon fiber, glass, mineral-filled, dielectric, and thermally conductive blends) can be processed with stable insert placement, predictable geometry, and consistent filler distribution. This enables mechanical support, alignment features, sealing structures, insulation, and thermal management to be integrated into fewer molded parts rather than added through secondary assemblies. For enclosures, structural mounts, RF and antenna components, optical carriers, and thermal interface structures, reduced shear and lower internal stress improve dimensional stability, material consistency, and functional repeatability. The result is fewer interfaces, fewer failure points, and manufacturing approaches that support defense requirements for environmental resilience, configuration control, and repeatable production across programs.