Advanced PCB Protection
- Electronics carriers tend to grow part count fast. We consolidate mounts and alignment features into molded carriers to simplify assembly.
- Traditional potting and coatings can introduce cure time, rework friction, and variability. We enable protective coverage around electronics with reduced mechanical stress and a simpler path to repeatable builds.
- Conventional electronics packaging becomes a stack of brackets and fasteners. We help you consolidate mechanical support into molded structure and reduce hardware complexity.
- When thermal management requires added parts and complex potting workflows, we enable more integrated protective coverage that supports thermal-driven packaging.
Connectors
- Instead of building retention with secondary hardware, we integrate retention and alignment features directly into the molded connector body.
- Traditional power connector thermal handling relies on added parts and conservative packaging. We enable more integrated connector structures that support thermal-aware designs.
- Sealed connectors often become multi-step assemblies. We integrate protective features into molded connector structures to simplify sealing approaches.
Enclosures & Housings
- Many enclosure programs get stuck between machining and complex assemblies. We help you move to scalable molded housings with integrated features once the design is ready.
- Sensor packaging is frequently limited by tolerance stack-up. We enable molded housings with integrated datum features that reduce downstream alignment effort.
- Reinforced polymers are often constrained by high-shear processing windows. We open up more practical paths to molded brackets and mounts using filled systems.
RF & Antenna Components
- High-shear processing can make filled polymer behavior inconsistent. We enable more consistent molded RF structures using specialized polymer systems.
Optical Components
- Optical assemblies are often limited by stress, warp, and fixture-heavy builds. We support more integrated optical carriers while keeping geometry consistent.
Thermal Management
- Thermal solutions often accumulate interfaces, pads, and assembly steps. We enable more integrated molded thermal interface structures using filled polymers.
Manufacturing for Aerospace Electronics Protection and Integration
Across aerospace and drone electronics, many assemblies become over-engineered through bracket stacks, secondary hardware, multi-step sealing, and conservative packaging because high-pressure or high-shear processes introduce warp, insert shift, fiber damage, thermal interface variability, and stress on sensitive components.
Controlled, low-stress molding and encapsulation processes enable a different outcome: reinforced and engineered polymer systems can be molded with predictable geometry, stable insert placement, and consistent filler distribution. This allows clips, bosses, alignment features, sealing structures, and mechanical support to be integrated directly into molded parts rather than added later.
For PCBs, sensors, RF assemblies, connectors, and power electronics, low-pressure encapsulation and controlled insert molding reduce mechanical stress on solder joints and embedded elements while improving repeatability compared to gravity potting, coatings, or multi-step sealing. For enclosures, brackets, optical carriers, and structural mounts, lower-shear molding preserves reinforcement integrity (short carbon fiber, glass, or mineral fills), reduces internal stress, and supports thin-wall features, stable datums, and complex 3D geometries at production scale. In RF, optical, and thermal interface components, improved control over polymer flow history and filler dispersion leads to more consistent material behavior, dimensional stability, and thermal or dielectric performance.
The net result is fewer parts, fewer interfaces, reduced tolerance stack-up, and more scalable manufacturing—achieved by addressing the underlying process limitations that traditionally force aerospace electronics into heavier, more complex mechanical solutions.