Advanced PCB Protection
- Electronics carriers tend to grow part count fast. We consolidate mounts and alignment features into molded carriers to simplify assembly.
- Traditional potting and coatings can introduce cure time, rework friction, and variability. We enable protective coverage around electronics with reduced mechanical stress and a simpler path to repeatable builds.
- Conventional electronics packaging becomes a stack of brackets and fasteners. We help you consolidate mechanical support into molded structure and reduce hardware complexity.
- When thermal management requires added parts and complex potting workflows, we enable more integrated protective coverage that supports thermal-driven packaging.
Connectors
- Instead of building retention with secondary hardware, we integrate retention and alignment features directly into the molded connector body.
- Traditional power connector thermal handling relies on added parts and conservative packaging. We enable more integrated connector structures that support thermal-aware designs.
- Sealed connectors often become multi-step assemblies. We integrate protective features into molded connector structures to simplify sealing approaches.
Enclosures & Housings
- Many enclosure programs get stuck between machining and complex assemblies. We help you move to scalable molded housings with integrated features once the design is ready.
- Sensor packaging is frequently limited by tolerance stack-up. We enable molded housings with integrated datum features that reduce downstream alignment effort.
- Reinforced polymers are often constrained by high-shear processing windows. We open up more practical paths to molded brackets and mounts using filled systems.
RF & Antenna Components
- High-shear processing can make filled polymer behavior inconsistent. We enable more consistent molded RF structures using specialized polymer systems.
Optical Components
- Optical assemblies are often limited by stress, warp, and fixture-heavy builds. We support more integrated optical carriers while keeping geometry consistent.
Thermal Management
- Thermal solutions often accumulate interfaces, pads, and assembly steps. We enable more integrated molded thermal interface structures using filled polymers.
Manufacturing for Automotive & Mobility Electronics
In automotive and mobility electronics, many designs accumulate secondary hardware, multi-step sealing, and stacked interfaces to manage risk from high-pressure molding, gravity potting, and high-shear over molding. These legacy processes introduce warp, insert shift, fiber damage, cure-time friction, thermal-interface stacks, and mechanical stress on solder joints, windings, and delicate components—pushing ECUs, charging controllers, radar/lidar modules, motors, connectors, and bus bars toward larger, heavier, and more complex assemblies than functionally required.
Controlled molding, over molding, and low-pressure encapsulation address these root causes directly. Reinforced and engineered polymer systems (including short-fiber, mineral-filled, elastomer-modified, and thermally conductive blends) can be processed with predictable geometry, stable insert placement, and repeatable filler distribution. This enables clips, bosses, alignment features, strain relief, sealing structures, insulation, and mechanical support to be integrated into fewer molded parts rather than added later. For enclosures, sensor housings, structural brackets, optical carriers, and film overlays, reduced internal stress and lower shear improve dimensional stability, surface durability, and material consistency at automotive production volumes. The result is fewer parts, fewer interfaces, improved thermal and environmental protection, and manufacturing scalability aligned with automotive cost, reliability, and throughput requirements.