Medical Devices

Advanced PCB Protection

  • Electronics packaging tends to accumulate hardware. We simplify builds by integrating mounts and alignment into molded carriers.

Batteries

  • Isolation and protection often require layered assemblies. We enable integrated isolation through encapsulation while protecting embedded elements.
  • Battery packaging often demands multiple operations. We enable integrated encapsulation approaches that simplify builds and support repeatable production.
  • Traditional isolation can require multiple components and assembly steps. We enable integrated isolation through encapsulation while protecting embedded elements.

Connectors

  • Connector alignment often drives rework. We integrate alignment and retention features directly into molded connector structures.

Functional Structures

  • Fluidic assemblies often include multiple joints and seals. We enable molded manifolds with integrated flow paths that reduce assembly complexity.

Enclosures & Housings

  • Sealing often means gaskets, adhesives, and added steps. We enable integrated protective transitions through overmolding to simplify assembly.
  • Sensor packaging often suffers tolerance stack-up. We enable molded housings with integrated datum features to reduce adjustment work.

Optical Components

  • Optical builds can be fixture-heavy. We support integrated molded optical components while keeping geometry consistent.

Film Overlays

  • Post-applied overlays can wear and complicate cleaning workflows. We integrate films into molded surfaces for durable UI with fewer secondary steps.
  • Decorated film surfaces often fail in yield before they fail in design. We expand the workable window for overmolded films to support more stable production.
  • UI layers often become secondary operations. We integrate UI films into molded structures to reduce steps and improve surface durability.

Manufacturing for Medical Devices and Diagnostic Systems

Medical device designs frequently trend toward layered housings, secondary hardware, and multi-step encapsulation to manage risk around high-pressure molding, traditional potting, and adhesive-heavy assembly. These approaches introduce mechanical stress, cure-time variability, tolerance stack-up, and yield loss—complicating electrical isolation, environmental protection, and dimensional stability in batteries, electronics carriers, connectors, sensors, optics, and fluidic components. As devices move from pilot builds to regulated production, these process-driven workarounds increase variability and friction in validation, scale-up, and long-term reliability.

Controlled injection molding, insert molding, overmolding, and low-pressure encapsulation address these constraints at the source. Electrically insulating, reinforced, elastomeric, optical-grade, and chemically resistant polymer systems can be processed with reduced shear and internal stress, enabling predictable geometry, stable insert placement, and uniform coverage around sensitive electronics, battery cells, and fluidic paths. This allows electrical isolation, sealing, mechanical support, surface durability, and optical stability to be integrated directly into molded parts rather than assembled from layers. For enclosures, sensor housings, user interfaces, film overlays, and fluidic manifolds, improved dimensional stability and bonding consistency reduce leak paths, wear points, and assembly steps. The result is simpler, more repeatable device architectures that support manufacturing scalability, regulatory confidence, and reliable performance in clinical environments.