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Low Pressure Molding (LPM) |
Injection Molding |
Potting |
Conformal Coating |
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Encapsulation blocks moisture and vibration while creating a reliable thermal path away from hot components, reducing hotspots, and faults. |
Provides effective moisture and contamination protection for electronics, but offers limited heat dissipation and constrained performance for high-power or high-density boards. |
Poor fit due to high injection pressures and clamp forces that physically damage boards, solder, and components. |
Provides strong environmental protection, but air entrapment and long cure times can create thermal hotspots, insulation failures, and slow production throughput. |
Provides effective surface-level protection against moisture and contaminants, but offers minimal thermal mitigation and no structural or mechanical support. |
Advanced PCB Protection
PCB protection often becomes a three-part challenge: environmental exposure, thermal demands, and build complexity. To hit targets, designs drift toward larger housings and seals, layered thermal interfaces, and bracket-heavy assemblies. X2F enables protective coverage that supports compact, thermally driven designs. This helps manufacturers protect PCBs without relying on oversized enclosures, interface stacks, or hardware-heavy packaging.
Environmental and Thermal Performance in Complementary Design
Protection and thermal management are frequently handled as separate problems, solved by stacking layers and interfaces onto the PCB. X2F enables more integrated protective coverage and encapsulation approaches that reduce interface stacking, allowing environmental robustness and thermal performance can be addressed together in a simpler physical stack-up.
Shock and Vibration Support with Simpler Structures
Shock and vibration requirements often drive the use of mounts, stiffeners, brackets, and fasteners until the packaging becomes the project. X2F helps consolidate mechanical support into molded structures and carriers, integrating mounting and alignment features to reduce part count, simplify assembly, and improve robustness.
Materials Selected for the Application
X2F is well suited to use advanced polymers matched to the job, balancing environmental resistance, thermal behavior, and mechanical durability. This gives manufacturers flexibility to choose material properties that fit the environment, thermal needs, and loads, rather than designing around a single conventional approach.
Mold-Around-Electronics Packaging Options
Where conventional molding limits the ability to form protection directly around electronics, X2F enables mold-around-electronics concepts that expand packaging options and reduce the need for separate protection operations.