Making melts flow better
As electronic components become smaller and more complex, the challenges increased for developers of engineering thermoplastics. Peter Mapleston finds out about new processes and offerings from materials suppliers
Over-moulding electronics: making melts flow better
The need for efficient low-pressure encapsulation of electronics has never been as great as it is today. The Internet of things IOT depends on a foundation of sensors and associated electronic connections and components to sport all sorts of devices in the home, at work, and on the move. This trend has also led to increased network connectivity demands for data and power cables and connectors that function in the harshest environments. Sensors are also increasingly used in medical diagnostics and wearables. In a large number of these applications the electronics need to be embedded in plastics to cushion them and to protect them from the local environment.