Printed Circuit Boards

Thermal performance without aluminum.

Mold thermally conductive material directly onto the PCB for heat management and protection against moisture, shock, and vibration.

Thermal Management & Environmental Protection

Combine thermal management and environmental protection in a simpler encapsulation approach with fewer stacked interfaces.

Thermal and environmental demands can be addressed together in a more integrated design.

Integrate support, mounting, and alignment features into molded structures to reduce part count and simplify assembly.

Shock and vibration support can be built in with fewer parts and simpler assembly.

X2F enables the use of advanced polymers selected for the right balance of environmental protection, thermal management, and mechanical durability.

The material can fit the application instead of forcing the application to fit the material.

X2F supports mold around electronics concepts that reduce separate protection operations and open up new packaging approaches.

Protection can be integrated more directly into the package design.

How We Compare
	Low Pressure Molding (LPM)	Injection Molding	Potting	Conformal Coating
Encapsulation blocks moisture and vibration while creating a reliable thermal path away from hot components, reducing hotspots, and faults.	Provides effective moisture and contamination protection for electronics, but offers limited heat dissipation and constrained performance for high-power or high-density boards.	Poor fit due to high injection pressures and clamp forces that physically damage boards, solder, and components.	Provides strong environmental protection, but air entrapment and long cure times can create thermal hotspots, insulation failures, and slow production throughput.	Provides effective surface-level protection against moisture and contaminants, but offers minimal thermal mitigation and no structural or mechanical support.