Printed Circuit Boards
Thermal performance without aluminum.
Mold thermally conductive material directly onto the PCB for heat management and protection against moisture, shock, and vibration.
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Low Pressure Molding (LPM) |
Injection Molding |
Potting |
Conformal Coating |
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Encapsulation blocks moisture and vibration while creating a reliable thermal path away from hot components, reducing hotspots, and faults. |
Provides effective moisture and contamination protection for electronics, but offers limited heat dissipation and constrained performance for high-power or high-density boards. |
Poor fit due to high injection pressures and clamp forces that physically damage boards, solder, and components. |
Provides strong environmental protection, but air entrapment and long cure times can create thermal hotspots, insulation failures, and slow production throughput. |
Provides effective surface-level protection against moisture and contaminants, but offers minimal thermal mitigation and no structural or mechanical support. |