DEFENSE
Integrated protection for demanding defense environments.
Built for defense electronics integration
Protection, sealing, thermal management, alignment, and mechanical support do not need to be separate operations.
X2F helps simplify defense electronics and electromechanical assemblies by molding functional features directly into the part, reducing added hardware, stacked interfaces, and complex secondary processes.
Electronics Protection & Thermal Management
Combine electronics protection and thermal management into molded structures that reduce cure time, stacked interfaces, added materials, and assembly steps.
Protection and thermal performance can be built into defense electronics instead of added around them.
Integrated Support, Retention & Alignment
Consolidate mechanical support, retention, alignment features, and connector packaging directly into molded carriers, housings, and connector bodies.
Mechanical support and retention can be molded in with fewer brackets, fasteners, and secondary parts.
Ruggedized Enclosures, Housings & Power Distribution
Move from machined parts and complex assemblies to molded housings, mounts, brackets, and encapsulated bus structures with integrated functional features.
Rugged housings and power packaging can be designed for protection, precision, and scalable production in fewer parts.
RF, Optical & Sensor Component Integration
Support more consistent RF, antenna, optical, and sensor structures by using controlled molding approaches that reduce stress, warp, and material variability.
Precision components can be molded with more stable geometry and fewer fixture heavy assembly steps.