Built for aerospace electronics integration
Protection, mounting, sealing, thermal management, and alignment do not need to be separate operations.
X2F helps simplify aerospace and drone assemblies by molding functional features directly into the part, reducing added hardware, stacked interfaces, and complex secondary processes.
Electronics Protection & Thermal Management
Combine electronics protection and thermal management into molded structures that reduce potting, coatings, added interfaces, and assembly steps.
Protection and thermal performance can be built into the package instead of added around it.
Integrated Support, Mounting & Alignment
Consolidate mounts, bosses, clips, retention features, and alignment datums directly into molded carriers, housings, and connector bodies.
Mechanical support can be molded in with fewer brackets, fasteners, and tolerance stackups.
Scalable Enclosures & Housings
Move from machined parts and complex assemblies to molded housings with integrated sealing, datum, mounting, and structural features.
Aerospace housings can be designed for protection, precision, and production scale in one molded structure.
RF, Antenna & Optical Component Integration
Support more consistent RF, antenna, and optical structures by using controlled molding approaches that reduce stress, warp, and material variability.
Precision components can be molded with more stable geometry and fewer fixture heavy assembly steps.