enclosures & housings
More integrated housings with fewer parts and more design flexibility.
X2F technology supports enclosure designs that combine structure, sealing, and component integration in a single molded part.
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Low Pressure Molding (LPM) |
Injection Molding |
Potting |
Conformal Coating |
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Sealing prevents corrosion/fretting at contacts while maintaining stable geometry and insulation under temperature swings that otherwise cause resistance rise and signal issues. |
Gentle encapsulation protects contacts and terminations in simple connector designs, with minimal capability for thermal management or complex geometries. |
Generally unsuitable for encapsulating finished connectors, as pressure and flow can deform housings and disrupt contact alignment. |
Durable environmental protection, but bulk, weight, and lack of precision make it poorly suited for compact or high-density connector systems. |
Surface coating can reduce corrosion risk on exposed areas, but does not protect mating interfaces, provide sealing, or stabilize contact geometry. |