enclosures & housings
More integrated housings with fewer parts and more design flexibility.
X2F technology supports enclosure designs that combine structure, sealing, and component integration in a single molded part.
More integrated housings with fewer parts and more design flexibility.
X2F technology supports enclosure designs that combine structure, sealing, and component integration in a single molded part.
|
Low Pressure Molding (LPM) |
Injection Molding |
Potting |
Conformal Coating |
|---|---|---|---|---|
|
Provides sealed protection while managing internal heat soak—supporting stable dimensions and longer life for electronics inside. |
Well suited for sealed housings where ingress protection is prioritized over structural stiffness, dimensional precision, or heat transfer. |
Ideal for standalone structural housings where high strength, dimensional accuracy, and cosmetic quality are required without sensitive inserts. |
Strong environmental sealing, but heavy sections, long cure cycles, and geometry constraints limit scalability and design flexibility. |
Limited to internal surface protection only; not suitable for providing sealing, structural integrity, or mounting functionality. |