AUTOMOTIVE & MOBILITY
Lighter, more integrated electronics assemblies.
Built for automotive electronics integration
Protection, sealing, thermal management, strain relief, and mechanical support do not need to be separate operations.
X2F helps simplify automotive and mobility assemblies by molding functional features directly into the part, reducing added hardware, stacked interfaces, and complex secondary processes.
Electronics Protection & Thermal Management
Combine electronics protection and thermal management into molded structures that reduce potting, coatings, added interfaces, and assembly steps.
Protection and thermal performance can be built into automotive electronics instead of added around them.
Integrated Support, Retention & Alignment
Consolidate mounts, bosses, clips, retention features, strain relief, and alignment datums directly into molded carriers, housings, and connector bodies.
Mechanical support can be molded in with fewer brackets, fasteners, and tolerance stackups.
Scalable Enclosures, Housings & Brackets
Move from machined parts and complex assemblies to molded housings, sensor packages, brackets, and mounts with integrated functional features.
Automotive housings can be designed for protection, precision, and production scale in one molded structure.
Sensor, RF & Optical Component Integration
Support more consistent radar, lidar, antenna, optical, and sensor structures by using controlled molding approaches that reduce stress, warp, and material variability.
Precision components can be molded with more stable geometry and fewer fixture heavy assembly steps.