Mold thermal management and protection directly into the part.
X2F precision molding technology enables thermally conductive materials to be molded directly around electronics, motors, heat sensitive components, and printed circuit boards. Instead of relying on separate heat sinks, potting, conformal coatings, low pressure molding systems, thermal interface materials, or secondary protection layers, manufacturers can integrate thermal management and environmental protection into the molded design.
The Thermal Management Turnkey Program is designed for manufacturers that are looking to improve thermal efficiency, increase design flexibility, reduce package size, and integrate protection directly into molded components.
