In this issue:
- How X2F Stood Out at PTXPO 2026
- CM4 Thermal Test Reveals a Better Cooling Approach
- Real Time Process Visibility with X2F Software
- See X2F at Thermal Management Expo
Highlights from PTXPO 2026
X2F showcased live molding demonstrations, mainstage insights, and thermal management innovation at PTXPO 2026.
Live Demonstrations of the X2F E60Vi Machine
We showcased the E60Vi machine with live demonstrations throughout the event, giving attendees a real time look at its performance, consistency, and production capabilities.
During these demonstrations, we over molded Raspberry Pi CM4s using KM15 from Kerfol, a thermally conductive polycarbonate material.
This application highlighted the E60Vi’s ability to process advanced engineering materials while producing precise, repeatable results on sensitive electronic components.
X2F on the PTXPO Mainstage
Two presentations highlighting how X2F is advancing manufacturing performance and rapid product development.
How Data Driven Injection Molding Reduces Risk
Rick Fitzpatrick explains how X2F uses closed loop control to improve consistency, reduce risk, and support faster development.
- Lower molding pressure
- Simplify tooling
- Support automation and AI ready digital twins
Reduce Product Development Cycle Times with X2F Rapid Development
Ken Jacob and Rich Oles show how additive manufacturing can improve tooling, speed production, and expand design flexibility.
- Improve tooling performance
- Speed production
- Extend tool life
CM4 Demonstrator
Raspberry Pi CM4 modules are tested under identical stress conditions. See the performance results below.
- At PTXPO, we showcased our CM4 Demonstrator, a live comparison of Raspberry Pi CM4 modules tested under identical stress conditions.
- The over molded CM4s deliver aluminum heatsink level thermal performance at significantly lower cost, while also providing environmental protection and greater design flexibility.
X2F Software & Analytics
Real Time Process Visibility and Control
X2F gives manufacturers clearer visibility and control throughout the molding process.
Because our process runs at lower pressures, the shot can be adjusted while it is happening. We call this a Fixed Output Process, and it allows for real time control and a more consistent result.
Process data without delay
X2F captures 86 variables directly from the PLC at multiple speeds, from high speed signals every 10 milliseconds to cycle statistics captured once per shot.
This gives manufacturers a detailed view of each shot, including:
- Live cycle charts
- Cycle summary statistics
- Historical shot visualization
- Ad hoc reporting
Built for real time control
An edge computer connects directly to the PLC to manage high speed data capture and real time interaction. Connectivity is configured for each installation, with VPN and cellular options available.
PID loops are used to adjust the process during the shot, using inputs such as back screw pressure, cavity pressure, and torque load. These continuous adjustments help keep the process aligned with the target result.
Interested in learning more? Email Us
See X2F and Rico Products at
Thermal Management Expo North America
Join X2F and Rico Products at Thermal Management Expo in Cleveland, May 5 to 6.
Visit Booth 1144 to see our CM4 Demonstrator and learn how X2F & Rico Products are advancing thermal management for delicate electronics.
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